| ACRONYM |
MEANING |
| AC |
Alternating Current |
| DAR |
Daily Activity Report |
| DC |
Direct Current |
| DM |
Debit Memo |
| DOS |
Drop-off Supplier |
| DR |
Delivery Receipt |
| DTA |
Direct to Account |
| ESR |
Equipment Service Report |
| LOA |
Local Order Acceptance |
| MTBF |
Mean Time Between Failure |
| MTBA |
Mean Time Before Assist |
| OW |
Out of Warranty |
| PI |
Proforma Invoice |
| PM |
Preventive Maintenance |
| PO |
Purchase Order |
| POS |
Pick-up Supplier |
| PR |
Purchase Requisition |
| SE |
Sales Engineer |
| SOC |
Sales Order Confirmation |
| SP |
Service Personnel |
| SS |
Sales Support |
| UW |
Under Warranty |
FRONT-OF-LINE (FOL) PROCESSES
| WAFER PROBING |
probes are put into the wafer on the Prober machine then test is performed by the tester |
| BACK GRINDING |
the back of the wafer is grinded to a thinner thickness |
| DIE SAWING |
the wafers are mounted on the dicing tape and cut into singulated chips using precision diamond blade |
| 2nd OPTICAL INSPECTION |
for chipping misalignment visual inspection using microscope |
| DIE BONDING |
the IC chip is bonded on the pad of lead frame using die bonding preform (Ag paste / solder tape or epoxy) |
| WIRE BONDING |
the electrode pads of the IC chips are bonded to inner leads of lead frame using gold wire |
END-OF-LINE (EOL) PROCESSES
| MOLDING |
the wire bonded lead frames are encapsulated to the specified package type using epoxy resin |
| PLATING |
the molded lead frames are blasted by high-pressure water, sometimes with media to clean the leads of the molded strips. Then, the molded strip are pass to electroplating machine to coat the leads with solder |
| MARKING |
the molded portion of the strip is mark by laser or by a pad-marking machine |
| TRIM and FORM |
the connections in each leads are cut simultaneously and the leads are formed |
| OS TESTING |
the devices are tested for open-short circuit of the wires |
| FINAL TEST |
the device performance is being tested in a circuit with the test pattern of the tester |
| TAPING PROCESS |
the devices are placed in a tape or in a shipping tube |